Webinar: System-Level Thermal Signoff from Chips Through to Racks

Webinar: System-Level Thermal Signoff from Chips Through to Racks
by Admin on 03-16-2023 at 2:34 pm

Date: Thursday, April 27, 2023

Time: 10:00am PT/1:00pm ET

Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature

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