Synopsys and Intel Foundry are expanding their collaboration to accelerate customer adoption of Intel 14A, connecting advanced process technology with production-ready electronic design automation, silicon intellectual property, multiphysics analysis, and multi-die integration. Announced at the 2026 DAC Chips to … Read More
Tag: PowerVia
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to Compete
The semiconductor industry is in the midst of a structural supply challenge that’s tightly coupled to exploding demand for advanced chips, especially those used in AI, HPC, and next-generation mobile and consumer devices. At the center of this vortex is the 2nm class of manufacturing technology, representing one of the most … Read More
Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
