Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


Effect of Inductance on Interconnect

Effect of Inductance on Interconnect
by Daniel Nenni on 03-02-2014 at 11:00 am

In previous design generations interconnect could safely be modeled by extraction using just R and C values. Parasitics in interconnect are important because they can affect the operating frequency or phase error in circuits like VCO’s. The need to model parasitics properly in wires is just as applicable in PA’s, LNA’s and for… Read More