Engineering the Next Era of Semiconductor Innovation

Engineering the Next Era of Semiconductor Innovation
by Kalar Rajendiran on 05-27-2026 at 8:00 am

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The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Siemens,… Read More


Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration

Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration
by Admin on 08-01-2024 at 4:00 pm

In a DACtv session on July 22, 2024, Rich Goldman from Ansys discussed the partnership with NVIDIA, focusing on accelerating engineering simulations and visualizing 3D IC designs in Omniverse. The collaboration, outlined in six pillars defined by NVIDIA CEO Jensen Huang, leverages NVIDIA’s GPUs and Grace CPUs to enhance… Read More