Defect-Pattern Leveraged Inherent Fingerprinting of Advanced IC Package with TRI

Defect-Pattern Leveraged Inherent Fingerprinting of Advanced IC Package with TRI
by Navid Asadizanjani on 10-29-2024 at 10:00 am

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In the quest to secure the authenticity and ownership of advanced integrated circuit (IC) packages, a novel approach has been introduced in this paper that capitalizes on the inherent physical discrepancies within these components. This method, distinct from traditional strategies like physical unclonable functions (PUFs)… Read More


Electron Beam Probing (EBP): The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs with Backside PDN

Electron Beam Probing (EBP): The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs with Backside PDN
by Navid Asadizanjani on 10-15-2024 at 10:00 am

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The outsourcing fabrication of ICs makes them vulnerable to hardware security threats. Security threats such as reverse engineering, insertion of hardware Trojan, and backside contact-less probing to steal cryptographic information can cause financial loss to IP owners and security risk to the system in which these ICs are… Read More