The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
Podcast EP374: How proteanTecs Tames Multi-Die Packaging Challenges with Nir Server
Daniel is joined by Nir Sever, an industry veteran with over 30 years of technological and managerial experience in advanced VLSI engineering. Before joining proteanTecs, Nir served for 10 years as the COO of Tehuti Networks, a pioneer in the area of high-speed networking Semiconductors. Prior to that, he served for 9 years as … Read More
