Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025

Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025
by Daniel Nenni on 12-02-2025 at 10:00 am

Siemens MediaTek TSMC OIP 2025

In the competitive vertical of mobile System-on-Chip development, SRAM plays a pivotal role, occupying nearly 40% of chip area and directly impacting yield and performance. The presentation “Accelerating SRAM Design Cycles With Additive AI Technology,” co-delivered by Mohamed Atoua of Siemens EDA and Deepesh… Read More