IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences

IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, and More Discussing Chip Design Experiences
by Daniel Nenni on 11-29-2022 at 10:00 am

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Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.

See the full online conference agenda and list of speakers at www.ansys.com/IDEAS. The free registration will… Read More


Electrothermal Signoff for 2.5D and 3D-IC Systems

Electrothermal Signoff for 2.5D and 3D-IC Systems
by Daniel Nenni on 02-04-2021 at 6:37 pm

System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC… Read More