Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.
See the full online conference agenda and list of speakers at www.ansys.com/IDEAS. The free registration will… Read More
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC… Read More
