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#61DAC was buzzing with discussion of chiplet-based, heterogeneous design. This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More
All aspects of semiconductor design and manufacturing require collaboration across a global ecosystem. As complexity increases, so does the importance of good collaboration. This is especially true for advanced package design. Thanks to the movement to multi-die design, package development has become an incredibly difficult… Read More
