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For the past decade, KnowMade has been actively analyzing and tracking the intellectual property (IP) landscape in advanced semiconductor packaging, including glass interposers and glass core substrates. Glass, as an advanced packaging material, offers significant advantages over silicon interposers and organic… Read More
KnowMade will be attending the SEMICON Europa 2024 Conference in Munich, where Dr. Pauline Calka will present a poster on the Leading Patent Owners & New Entrants in Advanced Packaging.
She will be available in the networking area on the day of the Advanced Packaging Conference (Wednesday, November 13) to share the latest … Read More
