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Ansys Multiphysics Platformby Tom Dillinger on 07-26-2021 at 10:00 amCategories: Ansys, Inc., EDA
Background
Traditionally, the interface between chip designers and system power, packaging, reliability, and mechanical engineering teams was a relatively straightforward exchange of specifications. Chip designers developed preliminary power dissipation estimates, often based on a simplifying power/mm**2 value. … Read More
So you’ve decided to buy a new car? First you need to research, compare, and test drive before you finally get to drive that shiny new car home. Engineering teams choosing their preferred electromagnetic analysis tool face similar challenges. Historically, electromagnetic problems and analysis tools were relegated to a few … Read More
