High Density Advanced Packaging Trends

High Density Advanced Packaging Trends
by Mitch Heins on 07-19-2017 at 7:00 am

Thursdays at the Design Automation Conference (DAC) are always a good time to catch up on areas of technology which are adjacent to that which you normally work. The exhibit floor is over and you have more time to spend in seminars. At this year’s DAC, I took advantage of a half day seminar put on by Mentor, a Siemens business, … Read More


TSMC and Pokemon Go!

TSMC and Pokemon Go!
by Daniel Nenni on 08-09-2016 at 4:00 pm

As Pokemon Go invades the world, let me give you a firsthand player’s description of the game and why the next generation of augmented reality apps will energize the fabless semiconductor ecosystem and greatly benefit TSMC.

While I am not a “gamer” per say, I am a technologist and am always looking for new semiconductor market drivers.… Read More


The iPhone 7 Intel Modem Controversy Explained!

The iPhone 7 Intel Modem Controversy Explained!
by Daniel Nenni on 06-18-2016 at 7:00 am

The media is really having a field day on this one so I think it deserves further discussion. The rumor is that Intel has won the modem socket in the iPhone 7. The same rumor was circulating about Intel winning the modem socket for the iPhone 6 and the iPhone 5e so it really has reached urban legend status. The question I have is why does … Read More