Scaling AI Infrastructure with Next-Gen Interconnects

Scaling AI Infrastructure with Next-Gen Interconnects
by Kalar Rajendiran on 04-29-2025 at 6:00 am

Data Centers Reimagined for Future of Gen AI

At the recent IPSoC Conference in Silicon Valley, Aparna Tarde gave a talk on the importance of Next-Gen Interconnects to scale AI infrastructure. Aparna is a Sr. Technical Product Manager at Synopsys. A synthesis of the salient points from her talk follows.

The rapid advancement of artificial intelligence (AI) is fundamentally… Read More


The Growing Importance of PVT Monitoring for Silicon Lifecycle Management

The Growing Importance of PVT Monitoring for Silicon Lifecycle Management
by Kalar Rajendiran on 04-24-2025 at 6:00 am

SLM IP Target Applications

In an era defined by complex chip architectures, ever-shrinking technology nodes and very demanding applications, Silicon Lifecycle Management (SLM) has become a foundational strategy for optimizing performance, reliability, and efficiency across the lifespan of a semiconductor device. Central to effective SLM are Process,… Read More


Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?

Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
by Kalar Rajendiran on 01-28-2025 at 6:00 am

Synopsys Predictions for Multi Die Designs in 2025

Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More


Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro

Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
by Kalar Rajendiran on 10-30-2024 at 10:00 am

Alphawave Using proTeanTechs

As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
by Kalar Rajendiran on 07-29-2024 at 6:00 am

Industry First, Multi Protocol IO Connectivity Chiplet

In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More


Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips

Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips
by Kalar Rajendiran on 03-07-2024 at 10:00 am

Synopsys 1.6T Ethernet IP Solution Image 2

The demand for high-bandwidth, low-latency networking solutions has never been greater. As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centers become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative.… Read More


Accelerate AI Performance with 9G+ HBM3 System Solutions

Accelerate AI Performance with 9G+ HBM3 System Solutions
by Kalar Rajendiran on 03-06-2024 at 10:00 am

HBM3 PHY and Controller Memory Solution

In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More


Driving the Future of HPC Through 224G Ethernet IP

Driving the Future of HPC Through 224G Ethernet IP
by Kalar Rajendiran on 05-23-2023 at 10:00 am

Advanced DSP Implementations

The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More


Alchip is Golden, Keeps Breaking Records on Multiple KPIs

Alchip is Golden, Keeps Breaking Records on Multiple KPIs
by Kalar Rajendiran on 05-10-2023 at 10:00 am

Alchip Revenue Breakdown along Nodes and Applications

I don’t know the story behind the name Alchip. I’ve been asking this question ever since its founding in 2003 and still haven’t found the answer. Wikipedia sometimes provides insights and stories behind names of companies, products and services but I couldn’t find any regarding the name Alchip. One thing is for sure. After its consistent… Read More