Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro

Datacenter Chipmaker Achieves Power Reduction With proteanTecs AVS Pro
by Kalar Rajendiran on 10-30-2024 at 10:00 am

Alphawave Using proTeanTechs

As semiconductor technology advances and nodes continue to shrink, designers are faced with increasing challenges related to device complexity, power consumption, and reliability. The delicate balance between high performance, low power usage, and long-term reliability is more critical than ever. This growing demand … Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
by Kalar Rajendiran on 07-29-2024 at 6:00 am

Industry First, Multi Protocol IO Connectivity Chiplet

In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More


Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips

Complete 1.6T Ethernet IP Solution to Drive AI and Hyperscale Data Center Chips
by Kalar Rajendiran on 03-07-2024 at 10:00 am

Synopsys 1.6T Ethernet IP Solution Image 2

The demand for high-bandwidth, low-latency networking solutions has never been greater. As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centers become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative.… Read More


Accelerate AI Performance with 9G+ HBM3 System Solutions

Accelerate AI Performance with 9G+ HBM3 System Solutions
by Kalar Rajendiran on 03-06-2024 at 10:00 am

HBM3 PHY and Controller Memory Solution

In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More


Driving the Future of HPC Through 224G Ethernet IP

Driving the Future of HPC Through 224G Ethernet IP
by Kalar Rajendiran on 05-23-2023 at 10:00 am

Advanced DSP Implementations

The need for speed is a never-ending story when it comes to data communications. Currently there are a number of trends such as cloud computing, artificial intelligence, Internet of Things (IoT), multimedia applications and consumer expectations driving this demand. All of these trends are accelerating the growth in high-performance-computing… Read More


Alchip is Golden, Keeps Breaking Records on Multiple KPIs

Alchip is Golden, Keeps Breaking Records on Multiple KPIs
by Kalar Rajendiran on 05-10-2023 at 10:00 am

Alchip Revenue Breakdown along Nodes and Applications

I don’t know the story behind the name Alchip. I’ve been asking this question ever since its founding in 2003 and still haven’t found the answer. Wikipedia sometimes provides insights and stories behind names of companies, products and services but I couldn’t find any regarding the name Alchip. One thing is for sure. After its consistent… Read More


Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More


Future.HPC is Coming!

Future.HPC is Coming!
by Daniel Nenni on 05-03-2022 at 6:00 am

HPC Image Altair SemiWiki

According to the experts, the semiconductor industry is poised for a decade of growth and is projected to become a trillion dollar industry by 2030. In 2021 the semiconductor industry finally hit $600B so $1T by 2030 seems like a big ask, but not really if you look at the indicators inside the semiconductor ecosystem. Foundries, … Read More


Maximizing ASIC Performance through Post-GDSII Backend Services

Maximizing ASIC Performance through Post-GDSII Backend Services
by Kalar Rajendiran on 03-04-2021 at 6:00 am

Panel 1 Alchip – HPC ASIC Manufacturing Done Your Way 1030x579 1

ASICs by definition are designed to meet the respective applications’ requirements. ASIC engineers deploy various design techniques to maximize performance, minimize power and reduce chip size. But is there more that can be done after the GDSII is taped out? A recent press release from Alchip Technology dated Feb 4, 2021 claims… Read More