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At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
In a keynote at the 62nd Design Automation Conference (DAC) on July 8, 2025, William Chappell, Vice President of Mission Systems at Microsoft, reflected on the intertwined evolution of AI and semiconductor design. Drawing from his DARPA experience, Chappell traced AI’s progression from 2016 onward, highlighting its… Read More
