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EMPC 2025 is the 25th European Microelectronics & Packaging Conference, an international event for microelectronics packaging, assembly, and interconnection technologies, taking place in Grenoble, France, from September 16–18, 2025. The conference focuses on advanced packaging, new materials, power electronics,… Read More
MPSoC 2025by Admin on 05-12-2025 at 6:56 pm
Focus
Multicore and Multiprocessor SoCs (MPSoCs) started a new computing era, but brought a twofold challenge: building HW easy to use by SW designers and building SW that fully exploits HW capabilities. The main domains addressed at MPSoC Forum are related to adapting HW and SW for better cost, performances and energy efficiency
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The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided… Read More
The headquarters of ST Microelectronics is officially in Switzerland, but in many ways the center of gravity is in the Grenoble area. You may have heard of Crolles where ST does process development, manufacturing and more, which is about ten miles north-east of the city. As a result, along with the CEA-LETI and Grenoble Institute… Read More
