In the rapidly evolving field of artificial intelligence (AI), the demand for efficient data processing has exposed limitations in traditional memory technologies. The paper “3D Stacked IGZO 2T0C DRAM Array with Multibit Capability for Computing in Memory Applications,” published in Science Advances on May… Read More
Tech Connect 2026
Co-organized by CEA-Leti and Soitec, the event invites you to step inside their lab-to-fab pipeline and discover the next advances in semiconductors, embedded AI, sequential 3D, FeRAM memory.
In an executive-level format, you will have the opportunity to:
• Connect and network with your peers
• Exchange directly with leading… Read More
