Alchip Technologies, a global leader in high-performance computing (HPC) and AI infrastructure ASICs, has officially launched its 2nm Design Platform, marking a major advancement in custom silicon design. The company has already received its first 2nm wafers and is collaborating with customers on the development of high-performance… Read More
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
It is a well-known fact that chiplets provide several advantages over traditional monolithic chips. Despite these benefits, the transition to a chiplet-based design paradigm presents challenges that need coordinated efforts across the industry. In essence, collaborative efforts among various players involved are not … Read More
Multi-die system design is clearly gaining momentum. Part of this momentum focuses on chiplets and a chiplet ecosystem. A “building block” approach for design will work better if there is a way to get verified, quality building blocks in the form of chiplets. The recent Chiplet Summit became an epicenter for this topic. The conference… Read More
