EDI CON Onlineby Admin on 08-19-2022 at 3:12 pm
WELCOME TO EDI CON ONLINE
EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand.
Keynotes, Technical… Read More
EDI CON Onlineby Admin on 08-19-2022 at 3:11 pm
WELCOME TO EDI CON ONLINE
EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand.
Keynotes, Technical… Read More
EDI CON Onlineby Admin on 08-19-2022 at 3:10 pm
WELCOME TO EDI CON ONLINE
EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand.
Keynotes, Technical… Read More
EDI CON 2022by Admin on 08-19-2022 at 3:09 pm
WELCOME TO EDI CON ONLINE
EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time training with easy registration and access. Content is available online, for free, to attendees live and on-demand.
Keynotes, Technical… Read More
While FinFET yield controversy is going on, I see a lot being done to improve that yield by various means. One prime trend today, it must be, it’s worthwhile, is to pull up various signoffs as early as possible during the design cycle. And DFM signoff is a must with respect to yield of fabrication. This reminds me about my patents filed… Read More
Last month Cadenceannounced its fastest parasitic extraction tool (minimum 5 times better performance compared to other available tools) which can handle growing design sizes with interconnect explosion, number of parasitics and complexities at advanced process nodes including FinFETs, without impacting accuracy of … Read More