TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging

TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
by Daniel Nenni on 09-24-2025 at 6:00 pm

TSMC OIP 2025

In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More