3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
