In the rapidly evolving semiconductor landscape, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside technologies are reshaping the future of compute systems. As detailed in their article, these innovations transition CMOS 2.0 from a conceptual framework to practical reality, enabling denser,… Read More
Tag: CMOS 2.0
SEMICON West- Jubilant huge crowds- HBM & AI everywhere – CHIPS Act & IMEC
– We just finished the most happy SEMICON West in a long time
– IMEC stole the show- HBM has more impact than size dictates
– Has Samsung lost its memory mojo? Is SK the new leader?
– AI brings new tech issues with it – TSMC is still industry King
Report from SEMICON West
The crowds at Semicon West were both… Read More