“Thinking Outside the Chip”

“Thinking Outside the Chip”
by Students@olemiss.edu on 04-13-2016 at 7:00 am

While pushing Moore’s Law’s boundaries in the world of 2D packaging, companies are starting to explore nontraditional approaches towards designing integrated circuit chips. 2D packaging is currently the most used method in designing chips in the industry, and while it leads in efficiency of power and performance, it lacks … Read More


Book Review: Mixed-Signal Methodology Guide

Book Review: Mixed-Signal Methodology Guide
by Daniel Payne on 08-23-2012 at 4:00 pm

Almost every SoC has multiple analog blocks so AMS methodology is an important topic to our growing electronics industry. Authored by Jess Chen (Qualcomm), Michael Henrie (Cliosoft), Monte Mar (Boeing) and Mladen Nizic (Cadence), the book is subtitled: Advanced Methodology for AMS IP and SoC Design, Verification and ImplementationRead More


Analog Panel Discussion at DesignCon

Analog Panel Discussion at DesignCon
by Daniel Payne on 01-20-2012 at 7:59 pm

DesignCon is coming up and the panel discussions look very interesting this year. The one panel session that I recommend most is called, “Analog and Mixed-Signal Design and Verification” which is moderated by Brian Bailey, one of my former Mentor Graphics buddies and fellow Oregonian.… Read More