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The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More
The traditional system-on-chip (SoC) design process has fully qualified verification methods embodied in the form of process design kits (PDKs). Why is it that chip design companies and assembly houses have no IC/package co-design sign-off verification process?
Package die are often produced using multiple processes and… Read More
