Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner

Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner
by Kalar Rajendiran on 06-15-2026 at 6:00 am

ESDA Panel Session June 10, 2026 IMG 6708

Highlights from a recent panel session moderated by Ed Sperling (Semiconductor Engineering) featuring Walden Rhines (Silvaco), Vincent Wong (Verific), Dave Kelf (Breker Verification Systems), Shelly Henry (MooresLab AI), Ann Wu (Silimate), and Cindy Cui (ChipAgents). The panel session was hosted by Electronic System … Read More