Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More


A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More