Tag: ansys

Webinar: MBSE for Safety-Critical and Fail-Operational SW Systems – EMEA

Webinar: MBSE for Safety-Critical and Fail-Operational SW Systems – EMEA
by Admin on 11-13-2024 at 12:16 am

We’ll introduce the benefits of a model-based approach in automotive safety critical software development for ISO 26262. Learn about how the qualification of SCADE benefits your software certification. Sign up for this presentation and hands-on workshop.

TIME:
December 3, 2024
9:30 AM – 4:30 PM CET

Venue:
Virtual

Overview

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Webinar: Virtual ISO 26262 Functional Safety Software Workshop for Automotive Value Chain

Webinar: Virtual ISO 26262 Functional Safety Software Workshop for Automotive Value Chain
by Admin on 11-13-2024 at 12:15 am

We are holding a free virtual training course specifically tailored for automotive OEMs, suppliers, and semiconductor industry professionals. This course will equip you with a better understanding of the software solutions available to help you comply with ISO26262.

TIME:
November 28, 2024
9:30 AM – 4:30 PM CET

Venue:
Virtual

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Webinar: Tackling the Challenges of Functional Safety and Cybersecurity – Virtual Hands-on Workshop

Webinar: Tackling the Challenges of Functional Safety and Cybersecurity – Virtual Hands-on Workshop
by Admin on 11-13-2024 at 12:05 am

This is a hands-on workshop where the participants will get an opportunity to work with Ansys Medini and perform safety analysis through the Ansys virtual lab.

TIME:
November 19, 2024
10AM IST to 5PM IST

Venue:
Virtual

Overview

Ansys medini analyze is a model-based, integrated tool supporting safety analysis for safety-critical

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Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization

Webinar: Accelerating Complex RF Filter Design With AI-Powered Optimization
by Admin on 11-13-2024 at 12:03 am

Join us for this webinar to explore how Ansys SynMatrix, powered by AI-driven automation and HFSS integration, is transforming RF filter design by streamlining workflows, optimizing performance, and accelerating time-to-market.

TIME:
November 19, 2024
8am PST

Venue:
Virtual

Overview

RF engineers face increasingly complex

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Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters

Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
by Daniel Nenni on 11-06-2024 at 10:00 am
Categories: 3D IC, Ansys, Inc., EDA, Events, Synopsys

banner for webinar

The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
by Admin on 11-05-2024 at 4:21 pm

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis… Read More

Power Innovations in Consumer Electronics: In-Person Sessions & Workshops at the Ansys San Jose Office

Power Innovations in Consumer Electronics: In-Person Sessions & Workshops at the Ansys San Jose Office
by Admin on 10-28-2024 at 3:06 pm

Get ready for an exciting and insightful day at the Ansys San Jose Office on November 6, 2024. Dive into the latest advancements in Ansys low-frequency EM simulation tools, their applications, and how they can accurately simulate EM fields in electronics and consumer electronic devices—this one-day event with expert-led sessions… Read More

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Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am
Categories: 3D IC, AI, Chiplet, EDA, Foundries, IP, Synopsys, TSMC

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More

Ansys IDEAS User Conference India 2024

Ansys IDEAS User Conference India 2024
by Admin on 09-27-2024 at 3:24 am

Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies.… Read More