As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and… Read More
As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More
Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More
In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More
The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More
Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, is a noted financial analyst who does a yearly presentation on the State of EDA during the Design Automation Conference (DAC). This year was no exception. He and I spent a memorable afternoon discussing the Synopsys-Ansys merger and startups. … Read More
Now that the dust has settled, I will give you my take on the Intel Foundry event. Some might call me a semiconductor event critic as I have attended hundreds of them over the last 40 years starting with the Design Automation Conference in 1984. Foundry events are my favorite because they really are the pulse of the semiconductor industry,… Read More
The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
