Tag: ansys

Webinar: Introducing Ansys TPT, Embedded Software Testing

Webinar: Introducing Ansys TPT, Embedded Software Testing
by Admin on 09-04-2026 at 1:38 am

Discover how to transform your embedded software testing with Ansys TPT, reducing cost, improving quality, and accelerating validation across all test levels. You’ll also explore how TPT, combined with SCADE, enables a seamless, scalable design-to-test workflow for modern, safety-critical systems.

Date/Time:

Session

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Webinar: Simulation for Data Center Cooling Infrastructure

Webinar: Simulation for Data Center Cooling Infrastructure
by Admin on 09-03-2026 at 1:50 am

AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency targets. Join this webinar to explore how simulation supports faster decisions, reduced risk, improved

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Webinar: Deploy and Scale Your Simulation in the Cloud with Ansys, part of Synopsys, and AWS

Webinar: Deploy and Scale Your Simulation in the Cloud with Ansys, part of Synopsys, and AWS
by Admin on 09-03-2026 at 1:45 am

Learn how Ansys, part of Synopsys, and AWS enable engineering teams to deploy and scale simulation workloads in the cloud. Discover how cloud solutions such as Ansys Cloud Burst Compute deliver faster results, greater flexibility, and on-demand access to powerful compute resources.

Overview

Learn how Ansys, part of Synopsys,

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Synopsys Wins the AI Silicon Brain Drain

Synopsys Wins the AI Silicon Brain Drain
by Daniel Nenni on 08-25-2026 at 4:00 pm
Categories: EDA, Synopsys
2 Comments

Synopsys Wins the AI SIlicon Brain Drain

The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More

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Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC

Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC
by Kalar Rajendiran on 02-17-2026 at 10:00 am
Categories: 3D IC, Chiplet, EDA, Synopsys

SNPS PathFinder SC ESD Verification

As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More

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Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions

Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
by Daniel Nenni on 09-29-2025 at 6:00 am
Categories: 3D IC, EDA, Events, Semiconductor, Synopsys, TSMC

synopsys tsmc oip 2025 leading the next wave of ai and multi die innovation for tsmc advanced node designs

Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More

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Synopsys Announces Expanding AI Capabilities and EDA AI Leadership

Synopsys Announces Expanding AI Capabilities and EDA AI Leadership
by Daniel Nenni on 09-12-2025 at 6:00 am
Categories: 3D IC, AI, EDA, Synopsys

Synopsys.ai Copilot Customer Impact

In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More

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eBook on Mastering AI Chip Complexity: Pathways to First-Pass Silicon Success

eBook on Mastering AI Chip Complexity: Pathways to First-Pass Silicon Success
by Admin on 09-01-2025 at 8:00 am
Categories: AI, Chiplet, EDA, Synopsys

MArtering AI Chip Complexity Synopsys

The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More

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Materials Selection Methodology White Paper

Materials Selection Methodology White Paper
by Daniel Nenni on 08-02-2025 at 6:00 am
Categories: Ansys, Inc., EDA

Materials Selection Methodology ANSYS

The Granta EduPack White Paper on Materials Selection, authored by Harriet Parnell, Kaitlin Tyler, and Mike Ashby, presents a practical and educational guide to selecting materials in engineering design. Developed by Ansys and based on Ashby’s well-known methodologies, the paper outlines a four-step process to help learners… Read More

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Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and Startups

Griffin Securities’ Jay Vleeschhouwer on EDA Acquisitions and Startups
by Bob Smith on 07-25-2025 at 6:00 am
Categories: EDA

jay vleeschhouwer SemiWiki Interview

Jay Vleeschhouwer, Managing Director of Software Research at Griffin Securities, is a noted financial analyst who does a yearly presentation on the State of EDA during the Design Automation Conference (DAC). This year was no exception. He and I spent a memorable afternoon discussing the Synopsys-Ansys merger and startups. … Read More