TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
COVID-19 underscores the importance of US-based production for strategic industries
The COVID-19 pandemic has drawn intense focus on the need to repatriate pharmaceutical manufacturing back to the United States. The increased awareness that a strategic adversary manufactures or controls up to 80% of the active pharmaceutical… Read More
At the recent DAC conference in Austin I attended a panel discussion over lunch where engineers from four companies talked about how they approached mixed-signal design and verification challenges for automotive and IoT systems. It seems like 2017 was the year of automotive at DAC, while in 2016 it was all about IoT. Both segments… Read More
Thursdays at the Design Automation Conference (DAC) are always a good time to catch up on areas of technology which are adjacent to that which you normally work. The exhibit floor is over and you have more time to spend in seminars. At this year’s DAC, I took advantage of a half day seminar put on by Mentor, a Siemens business, … Read More
High Bandwidth Memory (HBM) promises to do for electronic product design what high-rise buildings did for cities. Up until now, electronic circuits have suffered from the equivalent of suburban sprawl. HBM is a radical transformation of memory architecture that will have huge ripple effects on how SOC based electronics are … Read More
Next week there is a live seminar at the famed Computer Museum in Silicon Valley that you won’t want to miss. If you haven’t been to the Computer Museum here is what you are missing:… Read More
