A cautionary tale for the digital economy

A cautionary tale for the digital economy
by Terry Daly on 04-08-2020 at 10:00 am

TSMC Wafer

COVID-19 underscores the importance of US-based production for strategic industries

The COVID-19 pandemic has drawn intense focus on the need to repatriate pharmaceutical manufacturing back to the United States.  The increased awareness that a strategic adversary manufactures or controls up to 80% of the active pharmaceutical… Read More


Overcoming Mixed-Signal Design and Verification Challenges in Automotive and IoT Systems

Overcoming Mixed-Signal Design and Verification Challenges in Automotive and IoT Systems
by Daniel Payne on 08-10-2017 at 12:00 pm

At the recent DAC conference in Austin I attended a panel discussion over lunch where engineers from four companies talked about how they approached mixed-signal design and verification challenges for automotive and IoT systems. It seems like 2017 was the year of automotive at DAC, while in 2016 it was all about IoT. Both segmentsRead More


High Density Advanced Packaging Trends

High Density Advanced Packaging Trends
by Mitch Heins on 07-19-2017 at 7:00 am

Thursdays at the Design Automation Conference (DAC) are always a good time to catch up on areas of technology which are adjacent to that which you normally work. The exhibit floor is over and you have more time to spend in seminars. At this year’s DAC, I took advantage of a half day seminar put on by Mentor, a Siemens business, … Read More


How HBM Will Change SOC Design

How HBM Will Change SOC Design
by Tom Simon on 03-19-2016 at 7:00 am

High Bandwidth Memory (HBM) promises to do for electronic product design what high-rise buildings did for cities. Up until now, electronic circuits have suffered from the equivalent of suburban sprawl. HBM is a radical transformation of memory architecture that will have huge ripple effects on how SOC based electronics are … Read More