The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More


Translating Intel

Translating Intel
by Scotten Jones on 01-28-2015 at 10:00 pm

Some of Intel’s technology posts make some pretty specific statements and I have seen a number of posts where people seem to have misinterpreted what Intel was actually saying.

Multi Patterning
I have seen a lot of confusion on this one with some people saying Intel didn’t use multi patterning at 22nm and others saying Intel used … Read More