The Mechanical Reliability of IC Packages

The Mechanical Reliability of IC Packages
by Daniel Payne on 01-31-2016 at 12:00 pm

At Intel back in the late 1970’s we were designing DRAM chips and mounting them in ceramic and plastic packages, however there were problems when some of the die would crack inside of the package because of thermal mismatch issues with how the die was attached to the heat spreader inside the package. Back then we really didn’t… Read More