Tag: A14

TSMC 2026 China Technology Symposium

TSMC 2026 China Technology Symposium
by Admin on 04-29-2026 at 12:50 am

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphones, IoT, and Automotive platform solutions
  • TSMC’s advanced logic technology progress on 3nm, 2nm, A16, A14 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC®, InFO, CoWoS®, and TSMC-SoW™
  • TSMC’s
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The Shift to System-Level AI Drives Next-Generation Silicon

The Shift to System-Level AI Drives Next-Generation Silicon
by Kalar Rajendiran on 04-27-2026 at 8:00 am
Categories: 3D IC, AI, Chiplet, FinFET, Foundries, TSMC

TSMC Advanced Technology Roadmap

At its 2026 Technology Symposium, TSMC delivered a clear message: the AI era has entered a new phase. The primary constraint is no longer model capability, but the systems required to run those models at scale. Addressing this shift will demand significant advances in semiconductor technology, spanning compute, memory, interconnects,… Read More

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TSMC Describes Technology Innovation Beyond A14

TSMC Describes Technology Innovation Beyond A14
by Mike Gianfagna on 05-01-2025 at 10:00 am
Categories: Events, Foundries, TSMC
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Device Architecture Outlook

The inaugural event for the 2025 TSMC Technology Symposium recently concluded in Santa Clara, California. This will be followed by events around the world over the next two months. We have summarized information from this event regarding process technology innovation and advanced packaging innovation. Overall, the A14 process… Read More