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Managing Stress in 3Dby Beth Martin on 09-02-2014 at 1:32 pmCategories: EDA, Siemens EDA
A new publication on mechanical stress in integrated circuits, co-edited by Valeriy Sukharev, Principal Engineer for Calibre R&D at Mentor Graphics, has just been released by AIP Publishing. “Stress-Induced Phenomena and Reliability in 3D Microelectronics” includes 14 key papers from four international workshops … Read More