CEO Interview: Dündar Dumlugöl of Magwel

CEO Interview: Dündar Dumlugöl of Magwel
by Tom Simon on 12-19-2016 at 7:00 am

Magwel CEO Dündar Dumlugöl is well known from his days at Cadence, where I first met him, and for his more recent tenure at Magwel. At Cadence he led the team that first developed Spectre. He has come a long way from the start of his career at IMEC in Belgium. He and I had a chance to have a conversation recently where he offered insights … Read More


An Affordable 3D Field Solver at DAC

An Affordable 3D Field Solver at DAC
by Daniel Payne on 06-17-2011 at 6:35 pm

Intro
Massimo Sivilotti, Ph.D of Tanner EDA showed me their 3D field solver in the HiPer PX extraction tool at DAC last week.

Notes

Tool Suites – schematics, layout, SPICE simulation, DRC/LVS
– HiPer PX: 3D Field solvero Layers, dielectrics,
o Finite element analysis
o Boundary element methods
o 2D mode for pattern matching… Read More


Nimbic (formerly Physware) – 3D Field Solver in the Cloud or Desktop

Nimbic (formerly Physware) – 3D Field Solver in the Cloud or Desktop
by Daniel Payne on 06-13-2011 at 12:57 pm

I met with Bala Vishwanath, CMO at Nimbic on Monday morning. They had just announced a $6.9M round of venture capital which is something that you rarely hear about in EDA these days, especially during a slow economic recovery.

Intro

Physware – served the package and board markets, co-design challenges (can add IC noise sources).… Read More


Who Needs a 3D Field Solver for IC Design?

Who Needs a 3D Field Solver for IC Design?
by Daniel Payne on 04-07-2011 at 4:53 pm

Inroduction
In the early days we made paper plots of an IC layout then measured the width and length of interconnect segments with a ruler to add up all of the squares, then multiplied by the resistance per square. It was tedious, error prone and took way too much time, but we were rewarded with accurate parasitic values for our SPICE… Read More