The TSMC Open Innovation Platform (OIP) event brings together a wide array of companies reporting cutting edge work that are part of TSMC’s rather substantial ecosystem. The event covers everything from high-performance computing to mobile, automotive, IoT, RF and 3D IC design. Of particular interest for this post is a presentation… Read More
Webinar: Implementing DFT in 2.5/3D designs using Tessent Multi-die software
Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs.
Tessent Multi-die