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A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More
Dan is joined by Dr. Michael Mayer, the 2024 Electronic Components and Technology Conference (ECTC) Program Chair. Michael is an Associate Professor in the department of Mechanical and Mechatronics Engineering at the University of Waterloo in Ontario, Canada. Michael has co-authored technical publications and patents about… Read More
