Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli

In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package EDA tool to address, in the pre-layout stage the two major issues of 3D-IC design, thermal and mechanical stress.

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