Podcast EP323: How to Address the Challenges of 3DIC Design with John Ferguson
Daniel is joined by John Ferguson, senior director of product management for the Calibre products in the 3DIC space at Siemens EDA. He manages the vision and product offerings in the Calibre domain for 3DIC design solutions.
Dan explores the challenges of 3DIC and chiplet-based design with John, who describes the broad range of tools Siemens offers to address these challenges. John focuses on thermal, power and mechanical stress as three key aspects of advanced designs that must be carefully analyzed and optimized early. He explains how Calibre’s knowledge of the design forms the foundation for much of this work, with the addition of technologies such as multiphysics analysis to expand the scope.
John describes many real word scenarios for 3DIC design that require additional focus and the consequences of not getting it right. He also comments on the benefits of AI for advanced design flows.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
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