Podcast EP293: 3DIC Progress and What’s Coming at DAC with Dr. John Ferguson and Kevin Rinebold of Siemens EDA
Dan is joined by Dr. John Ferguson, Director of Product Management for the Calibre nmDRC and 3DIC related products for Siemens EDA. John has worked extensively in the area of physical design verification. Holding several patents, he is also a frequent author in the physical design and verification domain. Current activities include efforts to extend physical verification and design kit enablement for 3DIC design, Silicon Photonics, Quantum Compute and other HPC architectures. Also joining the podcast is Kevin Rinebold, a 3DIC Technologist at Siemens EDA. Kevin has multiple decades of experience in IC design and packaging.
Dan explores the current state of 3DIC design with John and Kevin. They explain that current popular applications are hypercalers and AI using silicon interposers. Future expansion is also discussed, which includes moving to other substrate materials to achieve higher density. Dan explores what the future holds in terms of challenges with John and Kevin. The ability to aggregate, track and analyze massive amounts of data across the design process is discussed. Digital twin technology is described as a way to develop a single source of truth for this process.
Dan then discusses some of the innovations that Siemens EDA will unveil at next week’s DAC. Streamlined workflows are discussed that focus on several areas. These include floor planning support for new substrates, protocol compliance, work-in-process data management and multiphysics analysis.
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