Principal Process Integration Engineer

Overview

• This position is for Principal Process Integration engineer supporting 200 and 300mm wafer fabs.
• The candidate will be responsible for driving continuous improvement in product and ET/PCM yield, and supporting new process development/introduction, and design rule and test structure development for new technologies.

Key tasks

• Responsible for developing/qualifying technology process flows and process integrations to enable meeting the product requirements for performance, reliability, and defect free manufacturing.
• Ensure methods and processes in place to test the devices and structures being developed.
• Support new designs with module characterization and design rule development.
• Develop and improve yield characterization and data analysis methodologies to rapidly determine yield limiters, correlation to in-line defectivity and metrology, and electrical parametric signals.
• Liaise with Quality Engineers to resolve customers’ technical & yield concerns and meet the requirements.
• Run Design of experiments to optimize process margins and determine process & Electrical test specifications.
• Experience of leading engineer team, developing and delivering technology for mass production.
• Lead Process FMEA and Transfer FMEA.
• Collaborate with PDK and Design Teams on Design rule check/ Design for manufacturing and define/document the design rules for the technologies.

Qualifications and training

• Bachelor’s Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Skills and experience

• Experience in high volume semiconductor manufacturing (200mm/ 300mm), with significant process integration or process development experience.
• Strong planning & organizational skills.
• Organized and systematic in problem solving, familiar with SPC, DOE & FMEA
• Strong communication, presentation, and interpersonal skills