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Foveros Direct Pathfinding Integration

Foveros Direct Pathfinding Integration
by Admin on 08-18-2025 at 6:47 pm

Website Intel

Job Description:

We are seeking a highly motivated and technically skilled Foveros Direct Pathfinding Integrator to lead the development and integration of cutting-edge technologies in advanced packaging.

The ideal candidate will play a key role in ensuring the successful technology development for future products.

Responsibilities included but not limited to the followings:

  • Lead the TV and Product NPIs, development and baseline data collection activities (for TV and Products) to integrate Foveros Direct next gen stack die on Co-EMIB and monolithic packages.
  • Lead the Package Design, DOE design and data collection activities that support key technology development areas related to die-package interactions, process flow development and qualification, yield improvement, process spec validation, design rule validation, identify and implement cost effective fab / assembly / substrate solutions that enable a robust die-package process and architecture.
  • Engage and work closely with key partners such as BU (through MisCos and PDTs), LTD, AFO, product design teams and ATTD stakeholders such as OATD-F, CATD, MTD, ADTS, Automation, xCC, QnR to deliver holistic solutions to the problems.
  • Develop solutions to problems utilizing statistical knowledge and problem-solving tools.
  • Achieve timely results by working across organizational boundaries, fostering an inclusive and innovative culture.

The ideal candidate should exhibit the following behavioral traits

  • Strong communication skills, Collaboration.
  • Innovative thinking. Attention to detail.
  • Proactive problem-solving. Curiosity and continuous learning.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.

Minimum skills and experience that will get you noticed: 

  • Candidate must possess a Bachelor’s Degree with 4+ years of relevant experience, OR
  • Master’s Degree with 3+ years of relevant experience, OR
  • PhD degree in Engineering with 1+ years of relevant experience.

Relevant experience should be in the following: 

  • Process Development: Experience with process control methodologies and statistical analysis tools
  • Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows.
  • Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.

 Preferred skills and experience that will make you stand out:

  • Focus on fundamental understanding of advanced packaging process development (Foveros/DOW processes, EMIB based assembly process or Foveros Direct/Hybrid Bonding processes).
  • Knowledge of WLA NPI methodology, DOE and statistical Process control.
  • Knowledge of characterization techniques such as CSAM, Xray, XPS, FTIR, SEM, EDX.
  • Experience in package design, assembly process interaction is a plus.
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To view the job application please visit intel.wd1.myworkdayjobs.com.

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