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S
Even if you don't, a node every single year is still impressive. Especially considering how Intel did before Gelsinger came back.
I...
Oct 25, 2025
M
Just a few top of mind thoughts.
Be more incremental about fab development, rather than dramatically over-spending on CAPEX.
Design a...
Oct 25, 2025
M
This is critical imo. I seriously wonder if Intel have figured this out even today. I fear they still don't get this. Maybe Lip Bu does...
Oct 25, 2025
S
Not sure how you define real innovation, but I would argue that since the end of Dennard scaling, every node has required significant...
Oct 25, 2025
It was never my intent to imply that TSMC just rode on Intel's coat tails. The fact that they have moved from being a fast follower to...
Oct 25, 2025
Not sure how you define real innovation, but I would argue that since the end of Dennard scaling, every node has required significant...
Oct 25, 2025
Intel did 4 CEO in 5 Months :)
Oct 25, 2025
A
Not sure how you define real innovation, but I would argue that since the end of Dennard scaling, every node has required significant...
Oct 25, 2025
Intel did 4 CEO in 5 Months :)
Oct 25, 2025
A
It was never my intent to imply that TSMC just rode on Intel's coat tails. The fact that they have moved from being a fast follower to...
Oct 25, 2025
A
Intel did 4 CEO in 5 Months :)
Oct 25, 2025
S
Intel did 4 CEO in 5 Months :)
Oct 25, 2025
S
Samsung 3nm had no customers due to a horrible PDK so 3nm was later renamed to Samsung 2nm. In my opinion Intel was first to HVM with...
Oct 25, 2025
O
Maybe the UMC/Intel 12nm node might be the answer. If that’s successful, there could be the potential for future UMC based EUV nodes as...
Oct 25, 2025
Intel is also first to GAA+BSPN in HVM as for advanced packing Intel has also made breakthrough what about Glass Substrates and Silicon...
Oct 25, 2025