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S
Like chiplets and all those 3D packaging in IC world, 3D DRAM type is inevitable.
Sep 30, 2025
S
3D DRAM is next ?
Sep 30, 2025
Woodcliff Lake, New Jersey — September 30, 2025
Verified, compact, and easy-to-integrate SM4 hardware engine meets Chinese-market...
Sep 30, 2025
Synopsys unveiled racetrack experience at the Aramco STEM Racing World Finals in Singapore ahead of releasing an enhanced, technical...
Sep 29, 2025
Credit: Nvidia
A new report claims that before Amazon or Google reveals anything about their latest artificial intelligence chips, they...
Sep 29, 2025
C
You should listen to the entire video. It is worth it.
Today -- Google makes something like $250B / year from advertising. All of it...
Sep 29, 2025
F
And destroy the world economy, along with total economic cataclysm at home. He is one of men who can actually do that.
They can try to...
Sep 29, 2025
X
The thinning of the dielectric between bit line and storage node contact results in rapidly growing parasitic capacitances and leakage...
Sep 29, 2025
X
The three companies have taken different paths, not just in EUV deployment. The shrink from 1a to 1b (14nm to 12nm) is larger than from...
Sep 29, 2025
B
I am sure he does!
I am assuming this is a valuation.
When do you think the public are going to be forced to pay for all applications...
Sep 29, 2025
S
I doubt they even tried seriously with Intel until now.
Sep 29, 2025
S
The belief in the "not foolish" rule is the cause of most man made major world disasters.
The higher one climbs in the bureaucracy, the...
Sep 29, 2025
S
I hope as well!!
Let INTEL do some hard R&D work on High-NA EUV to figure out some problems with High-NA HVM. And let INTEL guide ASML...
Sep 29, 2025
S
IIRC N7 DUV process used 4P4E while N7+/N6 used 1P1E. But it's a big misunderstanding to equalize the cost and yield of DUV 1P1E and EUV...
Sep 29, 2025
S
TSMC N6 and TSMC N5 came out at the same time (Q1 2020). TSMC considers N7, N7+ and N6 one node, that is how they report it. Same with...
Sep 29, 2025