Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=103171
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2030770
[XFI] => 1060170
)
[wordpress] => /var/www/html
)
You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today !
JavaScript is disabled. For a better experience, please enable JavaScript in your browser before proceeding.
You are using an out of date browser. It may not display this or other websites correctly.
You should upgrade or use an
alternative browser .
S
Other than HBM they are similar. but the Chip designs are different so its a wafer start issue (Assume cycle time from start to package...
Friday at 7:01 PM
D
Based on past experience, low power consumption will one day become a core technological competitiveness
Friday at 6:46 PM
J
N+2 is 93 mtr.
It has 63nm gate pitch and 252nm cell height which revealed by Techinsight.
118 mtr mean ~27% density improve, very huge.
Friday at 6:36 PM
Other than HBM they are similar. but the Chip designs are different so its a wafer start issue (Assume cycle time from start to package...
Friday at 6:15 PM
Great response -- and very interesting re: materials. That sounds like a supply chain weakspot, at least when you did the analysis...
Friday at 6:15 PM
They all use the same fab process although HBM add TSVs - basically do a new design and run it through the fab. There is no downtime...
Friday at 6:15 PM
They mostly do their own chips.
In my example systems companies are like Apple, Tesla, Google, etc.... Fabless Systems Companies where...
Friday at 4:28 PM
M
So do google and amazon make their own chips. Or do they give Inputs to Broadcom who tapeout their chips to TSMC? Historically when I...
Friday at 4:23 PM
Taiwan Semiconductor Manufacturing Co. CNA file photo
Washington, Dec. 11 (CNA) U.S. Commerce Secretary Howard Lutnick said Thursday he...
Friday at 4:23 PM
Good question.
Personally I think system companies will continue to make their own silicon. It really is a competitive advantage if you...
Friday at 4:00 PM
S
They all use the same fab process although HBM add TSVs - basically do a new design and run it through the fab. There is no downtime...
Friday at 3:54 PM
K
"Black" Projects often have "unknown" funding sources. There's no way we'll ever get accountability there, unfortunately.
Friday at 1:57 PM
A
Any thoughts on what the next advance will win the race and what companies stand the best chance of winning the race?
Friday at 1:01 PM
"Black" Projects often have "unknown" funding sources. There's no way we'll ever get accountability there, unfortunately.
Friday at 12:43 PM
Oddly, the US military doesn’t have a formal budget for much of the year in many recent years, which makes things even messier...
Friday at 12:42 PM
Like.
Other than HBM they are similar. but the Chip designs are different so its a wafer start issue (Assume cycle time from start to package...
Daniel Nenni reacted to MKWVentures's post in the thread How "fungible" are memory maker fabs for switching between memory types? with
Xebec replied to the thread The Navy says AI cut a 160-hour submarine-planning job down to just 10 minutes — now it's investing $448 million to go bigger."Black" Projects often have "unknown" funding sources. There's no way we'll ever get accountability there, unfortunately.