Arthur Hanson
Well-known member
Is this material a game changer or just a curiosity?
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Will Niobium Phosphide replace copper in chips?
- Thread starter Arthur Hanson
- Start date
Scotten Jones
Moderator
Everyone was thinking Ruthenium (Ru) but then they woke up to how expensive it is. My belief is Molybdenum (Mo) for vias first and then critical interconnect over the next several years. Mo is reasonably inexpensive, almost as low resistance at small dimensions as Ru, can be barrierless and can be etched. Lam has said they expect to sell a lot of Mo deposition tools this year.