Although the noise of the semiconductor boom has not completely subsided, the global advanced process competition is still fierce. The next-generation 2nm layout of wafer foundry leader TSMC (2330) continues to be carried out. The Hsinchu Baoshan factory is planned to start in the second quarter of 2024. The machine will enter mass production in the fourth quarter of 2025; and after the Kaohsiung plant officially completed its organization, it has recently notified equipment manufacturers to start the machine in the third quarter of 2025, and pilot run by the end of the same year, with the target of mass production in 2026.
Industry sources pointed out that the initial 2-nanometer production capacity of the Hsinchu Baoshan plant is about 30,000 pieces. The year after mass production in 2025, the Kaohsiung plant will introduce the N2P (2-nanometer enhanced version) process using crystal back power supply technology. The initial monthly production capacity is also about 3 million. Thousands of pieces. According to TSMC's previous press conference, the company has developed a backside power rail solution for N2. This design is most suitable for HPC-related applications.
Over the baseline technology, the backside power rail will increase speed by 10% to 12% and logic density by 10% to 15%. The goal is to launch the backside rails to customers in the second half of 2025, with mass production in 2026 . This coincides with recent rumors about the supply chain.
At the same time, according to foreign reports, TSMC plans to mass produce 1.4nm from 2027 to 2028 and name it "A14". According to the equipment supply chain, there is a high probability that 1.4nm will be settled in Kaohsiung in the future, but it is still far from the official mass production time. It remains to be seen whether there will be other variables such as political, economic and factory construction environment. (TSMC never comments on market rumors)
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