Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/threads/tsmc-ending-gan-on-si-manufacturing-by-2027.23127/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021770
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

TSMC ending GaN on Si manufacturing by 2027

osnium

Active member
Sourced from Navitas’ 8-K filing.

Positive
  • New foundry partnership: Navitas secured PSMC as an alternative GaN wafer source with mass production slated for H1 2026.
  • Advance notice: TSMC’s 2027 exit provides a two-year window for orderly transition, reducing immediate disruption risk.
  • Diversification strategy: Company is actively qualifying additional suppliers, aiming to enhance operational flexibility and reduce single-source dependence.
Negative
  • Supply-chain disruption risk: TSMC, the current sole supplier of GaN wafers, will stop production in July 2027.
  • Execution uncertainty: Successful qualification and ramp-up at PSMC are not guaranteed; delays could jeopardize product availability.
  • Lack of financial detail: Filing contains no information on cost structure, capacity commitments, or potential margin impact from the supplier shift

 
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