TSMC Board of Directors Meeting Resolutions

[Daniel Nenni]

HSINCHU, Taiwan, R.O.C., Nov. 11, 2025 – The TSMC (TWSE: 2330, NYSE: TSM) Board of Directors today held a meeting, which passed the following resolutions:

1. Approved the 2025 third quarter Business Report and Financial Statements. Third quarter consolidated revenue totaled NT$989.92 billion, and net income was NT$452.30 billion, with diluted earnings per share of NT$17.44.

2. Approved the distribution of a NT$6.0 per share cash dividend for the third quarter of 2025, and set March 23, 2026 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be March 17, 2026. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (March 19 through March 23, 2026) for registration transfer, and the dividend will be paid on April 9, 2026. In addition, the ex-dividend date and the record date for entitlement to participate in this cash dividend distribution for TSMC American Depositary Shares (ADSs) will be March 17, 2026.

3. To meet long-term capacity plans based on market demand forecasts and TSMC’s technology development roadmap, the Board approved capital appropriations of approximately US$14,981.60 million for purposes including: 1) Fab construction, and installation of fab facility systems; 2) Installation of advanced technology capacity; 3) Installation of advanced packaging, mature and/or specialty technology capacity; 4) 2026 R&D capital investments and sustaining capital expenditures; 5) 2026 capitalized leased assets.

4. Approved transaction to sell TSMC equipment valued at about between US$20 million and US$23 million to Vanguard International Semiconductor Corporation (VIS), an affiliate of TSMC.

TSMC Spokesperson​

Wendell Huang
Senior Vice President & Chief Financial Officer

TSMC Deputy Spokesperson​

Nina Kao
Public Relations Division

TSMC Media Contact​

press@tsmc.com

 

[Daniel Nenni]

TSMC's Board approved a $15.0B capital appropriation, down from $20.7B QoQ, shifting toward equipment CapEx (80% mix) and away from infrastructure (20%). Advanced nodes get $7.3B (slightly down QoQ), specialty devices/advanced packaging $1.2B (up QoQ), R&D $3.6B (annual, up from ~$2B in 2023-24), and infrastructure $3.0B (sharply down from $10.9B).

This marks the third straight quarter of robust equipment CapEx, with $12B total (including R&D), the highest since 3Q24. The $7.3B advanced-node spend to 20-30K wafers per month N3 expansions for mid-2026, supporting AI accelerator migrations from N5. Infrastructure's decline below 50% of total spend signals fab projects moving from construction to facilitation, favoring wafer fab equipment.

Bottom line: As we have seen in the past, leading-edge foundry/logic fab equipment looks set for solid 2026 growth from TSMC in 2026. As I have mentioned before, TSMC N3 is a record breaking node with 99% of the total available fabless design wins. TSMC N2 looks to repeat N3 with even more growth based on the AI boom, absolutely.