Google may be edging toward Intel. And for the first time in years, that possibility is putting real pressure on one of TSMC’s most important strongholds: advanced packaging.
At the center of this shift is a single constraint—size. As next-generation AI chips grow beyond the limits of CoWoS, Google is reportedly evaluating Intel’s EMIB as an alternative. That alone would have been unthinkable not long ago.
TSMC, however, is not standing still. In its latest earnings call, CEO C.C. Wei впервые pointed to CoPoS—a next-generation, panel-level packaging technology—as the company’s answer.
But CoPoS is still early. From CMP bottlenecks to glass-core substrates, scaling it will not be easy.
If packaging is TSMC’s moat, this may be the moment it is truly tested.
So the question is: can TSMC reinforce that moat in time?
https://cwnewsroom.substack.com/p/t...intel-can-tsmc-reinforce-its-competitive-moat
At the center of this shift is a single constraint—size. As next-generation AI chips grow beyond the limits of CoWoS, Google is reportedly evaluating Intel’s EMIB as an alternative. That alone would have been unthinkable not long ago.
TSMC, however, is not standing still. In its latest earnings call, CEO C.C. Wei впервые pointed to CoPoS—a next-generation, panel-level packaging technology—as the company’s answer.
But CoPoS is still early. From CMP bottlenecks to glass-core substrates, scaling it will not be easy.
If packaging is TSMC’s moat, this may be the moment it is truly tested.
So the question is: can TSMC reinforce that moat in time?
https://cwnewsroom.substack.com/p/t...intel-can-tsmc-reinforce-its-competitive-moat