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As univ assignment need to make small report on history & future market trends for test, burn-in, reliability, etc. service providers. Can share information or links?
Fabless or foundries bear the risk of faulty chips?
Does fabless companies prefer foundries to do it in-house or prefer to outsource it to dedicated service providers?
When an IC fails a test, then the designer needs to identify the source of the failure:
1) Logic bug - their own fault, and they must do a re-spin to fix the logic
OR
2) Processing bug - it the yield loss caused by the processing bug is high enough, the designer can alert the foundry to the failure type and location on the chip. Many processing failures are caught first at the foundry, so the designer may never see the failure at all. The foundry is highly motivated to fix the processing bug because it impacts chip yield, which directly controls their profit levels and yield.