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Softbank Corp, Intel announce memory chips collaboration

It may be Pat Gelsinger's game plan, but it is also his wishful thinking. He had invested so many resources into Intel Foundry but seems to have forgotten that the vast majority of Intel’s revenue and profit come from the Intel Product Division (the design side). Without competitive products from the Intel Product Division to sell and generate enough cash to fund Intel Foundry’s huge CapEx, his IDM 2.0 strategy won’t work, and it is killing Intel.
Intel product carried by Intel Fabs? Look at Intel Products going external and messing it up you seem to have forgotten the edge Fabs used to give to design one node ahead in the era of 0.5X Shrink with 20-25% perf/watt is a lot it's like 2 gen worth of area improvement and 1.5gen of perf/watt improvement in today's time.
It's not for Gelsinger that Intel blew up their advantage i would do the same thing and put resources into IFS though i would do it with careful planning not going overboard.
 
Intel product carried by Intel Fabs? Look at Intel Products going external and messing it up you seem to have forgotten the edge Fabs used to give to design one node ahead in the era of 0.5X Shrink with 20-25% perf/watt is a lot it's like 2 gen worth of area improvement and 1.5gen of perf/watt improvement in today's time.
It's not for Gelsinger that Intel blew up their advantage i would do the same thing and put resources into IFS though i would do it with careful planning not going overboard.

"Intel product carried by Intel Fabs?"

I'm not sure if I understand you clearly?
 
This picture is more accurate than all those ridiculous AI-generated art with diagonals.

The idea is to have more DRAM dies stacked laterally on their sides. The interconnects between the dies are part of the package rather than going through the dies.

The referred Intel patent application is mentioned here: https://www.computerbase.de/news/ar...-memory-zam-soll-besser-als-hbm-werden.96110/
 
This picture is more accurate than all those ridiculous AI-generated art with diagonals.

The idea is to have more DRAM dies stacked laterally on their sides. The interconnects between the dies are part of the package rather than going through the dies.

The referred Intel patent application is mentioned here: https://www.computerbase.de/news/ar...-memory-zam-soll-besser-als-hbm-werden.96110/
I'm sure national research institutes are also involved, right?
Both the US and Japanese sides
 
Note: to be less confusing to my fellow blogges, here is my revised edition:

Yes, Intel missed this golden opportunity (and many other memory or non-memory opportunities over the years). I almost feel as if there is a curse placed on Intel.

Nanya Technology, a smaller memory manufacturer in Taiwan, has seen its one‑year stock performance jump almost tenfold, despite its technology being two to three generations behind Samsung, SK Hynix, and Micron.

Intel, on the other hand, sold its NAND division to SK Hynix in 2020 and completed the transaction in March 2025. Intel’s intellectual property, R&D employees, and manufacturing assets related to NAND were transferred to SK Hynix through this sale. While NAND prices and demand are rising sharply, additional NAND supply is limited. Intel has lost the opportunity to participate in this NAND boom.
So DRAM and NAND are different…
I think Nanya is mainly DRAM.
 
This picture is more accurate than all those ridiculous AI-generated art with diagonals.

The idea is to have more DRAM dies stacked laterally on their sides. The interconnects between the dies are part of the package rather than going through the dies.

The referred Intel patent application is mentioned here: https://www.computerbase.de/news/ar...-memory-zam-soll-besser-als-hbm-werden.96110/
A zoom-in on the slide confirms this picture as well: https://www.techpowerup.com/345929/...-partner-on-next-gen-z-angle-memory#g345929-2

1770968075501.png
 
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