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SK Hynix to buy $8 billion in ASML chipmaking tools in largest disclosed order

Daniel Nenni

Admin
Staff member
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SEOUL, March 24 (Reuters) - Chipmaker SK Hynix (000660.KS) said on Tuesday it will purchase 11.95 trillion won ($7.97 billion) worth of ‌ASML's (ASML) EUV lithography tools, used to create chip circuitry, in ‌the largest single order publicly disclosed by an ASML customer.

In a regulatory filing, SK Hynix said it would purchase the tools by December 31, 2027 for use in the mass production of new products. Reuters reported in January that the firm plans to accelerate the opening of ‌a new plant in Yongin ⁠city to February 2027 to meet rising demand for memory chips.

What impact does this order have on ASML's business?

How will SK Hynix use EUV tools for production?

Why are memory manufacturers investing heavily in EUV technology?

What is SK Hynix's record EUV equipment purchase from ASML?

Ryu Young-ho, a senior analyst at NH ⁠Investment & Securities, said the order would be used both for the Yongin plant and the M15X plant in Cheongju, which will produce high bandwidth memory (HBM) chips needed for artificial intelligence.

"The EUV equipment purchased is therefore ‌expected to be used for both HBM and advanced DRAM," he said.

ASML HAD 38.8 BILLION EURO ORDER BACKLOG AT END OF LAST YEAR

Analyst David Dao of Bernstein estimated the order represents 30 new EUV machines over two years, slightly more than the 26 he ‌had previously forecast.

An ASML spokesperson said the company could not comment on customer business plans. ASML reported a 38.8 billion euro order backlog at the end ‌of 2025.

ASML shares were up 0.9% at 1,185.60 euros by 0822 GMT in Amsterdam. SK Hynix shares closed 5.7% higher after the Korea Economic Daily reported the company could raise up to $10 ‌billion from a U.S. listing.

 
With this order we learn that Hynix is:
-Investing in Korea
-Not investing in China
-Investing a lot

I would have loved if they invested in West Lafayette, IN as well but packaging fabs don't need lithography.

This will provide some relief to the memory crisis when the investment bears fruit in a few years.
 
..............

I would have loved if they invested in West Lafayette, IN as well but packaging fabs don't need lithography.

That seems to be changing for advanced packaging, ASML also wants to expand in that market:

https://www.trendforce.com/news/202...dge-may-reshape-advanced-packaging-landscape/

..........................................................
Industry sources note that ASML’s move into hybrid bonding is not unexpected. As early as 2024, the company introduced its first back-end system, the TWINSCAN XT:260 3D DUV lithography tool, designed for advanced packaging applications such as redistribution layer (RDL) patterning on interposers. ASML has also proposed integrated lithography solutions combining DUV and EUV scanners, achieving wafer bonding overlay accuracy of around 5 nm—laying the groundwork for further expansion into high-precision packaging processes.

ASML Chief Technology Officer Marco Peters has previously stated that the company is closely evaluating opportunities in semiconductor packaging and assessing how to build a relevant product portfolio. Following a review of technology roadmaps from memory manufacturers including SK hynix, ASML has reportedly confirmed clear demand for advanced stacking process equipment.
 
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